In our company’s Heat Dissipation and Insulation substrates, which utilize our thermoelectric module manufacturing technology, organic and metal substrates are commonly used for low-power household appliances and PCs. However, for insulated heat dissipation circuit substrates handling high power, substrates such as alumina oxide (Al₂O₃), aluminum nitride (AlN), and silicon nitride (Si₃N₄) are used.
Particularly, silicon nitride substrates are attracting attention for power modules in inverters/converters for electric vehicles. Our company has one of the world's largest production capacities for both conventional DCB (Direct Copper Bonding) substrates and AMB (Active Metal Brazing) substrates.
Additionally, we can manufacture DPC (Direct Plated Copper) substrates for data centers in the fifth-generation mobile communication system (5G), as well as DBA (Direct Bonded Aluminum) substrates used in parts requiring high reliability and heat dissipation characteristics, such as in cars, railways, and renewable energy.