Power Electronic Substrates
DCB / AMB / DBA / DPC
Power Electronic Substrates
DCB / AMB / DBA / DPC
DBA
Direct Bonded Aluminum
DBA (Direct Bonded Aluminum) substrates are electronic components in which aluminum is directly bonded to a ceramic substrate such as aluminum nitride (AlN) or alumina (Al₂O₃), and then forming an aluminum circuit. With excellent thermal shock resistance and electrical characteristics, it is an ideal material for high-voltage, large-current power devices.
Applications include Renewable energy, Electric trains, EVs, and more.
| DBA Product Characteristics | |||
|---|---|---|---|
| Item | Design Standard | Unit | |
| Mastercard Dimension | 138 × 190 | mm | |
| Maximum usable area | 127 × 178 | mm | |
| Solder mask | Pattern width | Min. 0.3 ± 0.2 | mm |
| Position tolerance | ± 0.3 | mm | |
| Min. spacing between solder mask pattern | ≧ 0.3 | mm | |
| Min. distance from edge of solder mask to aluminum edge ※Measurement reference point of aluminum edge is aluminum top side |
≧ 0.5 | mm | |
| Peeling Strength | > 19.6 (Al-Break) @AlN | N / mm | |
| Solderability | > 95 | % | |
| Delivery method | Single piece / Mastercard | ー | |
| Surface treatment | Solder mask Ni-plating NiAu-plating etc. |
ー | |
Please download the detailed specifications from the link below
Click here to download product catalog (PDF)