Power Electronic Substrates
DCB / AMB / DBA / DPC
Power Electronic Substrates
DCB / AMB / DBA / DPC
DPC
Direct Plated Copper
DPC (Direct Plated Copper) substrates form high-precision copper circuit patterns on ceramic substrates using electroplating methods. Surface treatment improves anti-oxidation properties and solder wettability, resulting in better component performance and high reliability.
Applications include optical communication, high-power semiconductor laser, high-power LEDs, LiDAR, and more.
| DPC Product Characteristics | |||
|---|---|---|---|
| Item | Design Standard | Unit | |
| Mastercard Dimension | □50.8 / □76.2 / □101.6 / □114.3 / □120.6 | mm | |
| Maximum usable area | □45 / □69.2 / □93.8 / □104.2 / □112.2 | mm | |
| Solder mask | Pattern width | Min. 0.15 | mm |
| Position tolerance | ± 0.2 | mm | |
| Min. spacing between solder mask pattern | 0.15 | mm | |
| Thickness tolerance | ± 10 【Thickness ≦ 30】 ± 15 【Thickness ＞ 30】 |
μm | |
| Solderability | > 95 | % | |
| Delivery method | Single piece / Mastercard | ー | |
| Surface treatment | Corrosion inhibitor Solder mask Ni-plating NiAu-plating NiPdAu-plating Ag-plating AuSn-plating etc. |
ー | |
Please download the detailed specifications from the link below
Click here to download product catalog (PDF)