Power Electronic Substrates
DCB / AMB / DBA / DPC

Power Electronic Substrate
DCB / AMB / DBA / DPC

AMB

Active Metal Brazing

AMB (Active Metal Brazing) substrates are electronic components in which copper plates are bonded to a ceramic substrate such as aluminum nitride (AlN) or silicon nitride (Si₃N₄) using active metal brazing materials, and then forming a copper circuit. Offering higher reliability and better heat dissipation than DCB substrates.
Applications include EVs, Electric trains, Power transmission systems, and industrial equipment, and more.

AMB Product Characteristics
Item Design Standard Unit
Mastercard Dimension 138 × 190 mm
Maximum usable area 127 × 178 mm
Solder mask Pattern width Min. 0.3 ± 0.2 mm
Position tolerance ± 0.2 mm
Min. spacing between solder mask pattern ≧ 0.3 mm
Min. distance from edge of solder mask to copper edge
※Measurement reference point of copper edge is copper top side		 ≧ 0 【Copper thickness ≦ 0.3】
≧ 1 【Copper thickness ≧ 0.4】		 mm
Peeling Strength ≧ 10 N / mm
Solderability > 95 %
Delivery method Single piece / Mastercard ー
Surface treatment Corrosion inhibitor
Solder mask
Half-Etching
Ni-plating
NiAu-plating
Ag-plating
etc. 		ー

Please download the detailed specifications from the link below

Click here to download product catalog (PDF)