Power Electronic Substrates
DCB / AMB / DBA / DPC
Power Electronic Substrates
DCB / AMB / DBA / DPC
DCB
Direct Copper Bonding
DCB (Direct Copper Bonding) substrates are electronic components in which copper plates are directly bonded to a ceramic substrate such as alumina (Al₂O₃) or alumina zirconia (Al₂O₃/ZrO₂), and then forming a copper circuit. They are widely used in power devices that require both electrical insulation and efficient heat dissipation.
Applications include industrial equipments, power supplies, home appliances, automotive components, and more.
| DCB Product Characteristics | |||
|---|---|---|---|
| Item | Design Standard | Unit | |
| Mastercard Dimension | 138 × 190 | mm | |
| Maximum usable area | 127 × 178 | mm | |
| Solder mask | Pattern width | Min. 0.3 ± 0.2 | mm |
| Position tolerance | ± 0.2 | mm | |
| Min. spacing between solder mask pattern | ≧ 0.3 | mm | |
| Min. distance from edge of solder mask to copper edge ※Measurement reference point of copper edge is copper top side |
≧ 0 【Copper thickness ≦ 0.3】 ≧ 1 【Copper thickness ≧ 0.4】 |
mm | |
| Peeling Strength | ≧ 5 | N / mm | |
| Solderability | > 95 | % | |
| Delivery method | Single piece / Mastercard | ー | |
| Surface treatment | Corrosion inhibitor Solder mask Dimple Half-Etching Ni-plating NiAu-plating Ag-plating etc. |
ー | |
Please download the detailed specifications from the link below
Click here to download product catalog (PDF)